Semiconductor Process Technologies

  • Typ: Lecture
  • Semester: SS 2020
  • Ort:

    ILIAS Website: https://ilias.studium.kit.edu/goto.php?target=crs_1113009&client_id=produktiv

  • Zeit:

    22.04.2020, Wednesday, 08:00-11:00
    06.05.2020, Wednesday, 08:00-11:00
    20.05.2020, Wednesday, 08:00-11:00
    03.06.2020, Wednesday, 08:00-11:00
    17.06.2020, Wednesday, 08:00-11:00
    01.07.2020, Wednesday, 08:00-11:00
    15.07.2020, Wednesday, 08:00-11:00

  • Dozent:

    Dr.-Ing. Mehmet Kaynak
    M. Sc. Ibrahim Kagan Aksoyak

     
  • LVNr.: 2308501

Title: Semiconductor Process Technologies (Halbleiter Prozesstechnologie)

Sommersemester: 2 SWS

Leistungspunkte: 4

Sprache: Englisch

Erfolgskontrolle(n): The success criteria will be determined by an oral examination (approx. 20-30 min.)

Modulnote: The module grade is the grade of the oral examination.

Voraussetzungen: None.

Qualifikationsziele:

  • The students acquire a comprehensive understanding of the integrated circuit fabrication of CMOS, BiCMOS and different MEMS processes, especially for mm-wave and THz applications.
  • They have a good understanding of the different process steps (i.e. lithography, chemical vapor deposition, reactive ion etch, cleaning and etc.) of a CMOS process flow.
  • They can describe a complex process flow of a CMOS process together with different high frequency modules such as MEMS and photonics.
  • They can identify the pros and cons of different process flows; thus correlate it with the throughput, yield and cost aspects of the semiconductor industry.
  • They are familiar with basic packaging approaches of integrated circuits and also special advanced packaging technologies for mm-wave and THz integrated circuits as well.
  • They have the basic understanding of the scaling of CMOS industry and the future trends.

Inhalt:

In this lecture the basic fabrication technologies of integrated circuits will be given together with the each individual process steps. The front-end and back-end of line parts of the full CMOS/BiCMOS process will be provided. The testing, process monitoring and throughput/yield studies of a CMOS process will be followed after basic understanding of the semiconductor process technologies. A special emphasis on MEMS process technologies will also be given and the integration challenges of additional modules into a CMOS/BiCMOS process will be detailed. Finally, the packaging aspect of the integrated circuit industry will be given for standard and advanced packaging needs. A basic topics planned to be studied under the course are given below:

  1. Integrated Circuit Processes
  2. Cleaning and wet processes
  3. Patterning Processes: Optical and E-beam lithography
  4. Thermal Processes: Oxidation, Diffusion, chemical vapor deposition
  5. Junction Formation: Ion Implantation, spin-on, annealing
  6. In-process monitoring,  measurement techniques, 
  7. Packaging: dicing , wire bonding, encapsulation
  8. Testing of Semiconductor Devices; Process Modelling and Yields
  9. MOS process integration and MEMS processes 
  10. Scaling and Future trends
  11. Non Silicon processing: III-V , MBE, OMCVD

Empfehlungen:

The lecture materials to „Grundlagen der Hochfrequenztechnik“ and „Halbleiterbauelemente“ are recommended.

Some other suggested references are given below:

  1. 1. Introduction to Microelectronic Fabrication; Jaeger;  Prentice Hall
  2. 2. The Science and Engineering of Microelectronic Fabrication; Campbell;  Oxford
  3. 3. Silicon Processing for the VLSI Era; Wolf and Tauber; Lattice Press
  4. 4. Microelectronics Processing and Device Design; Colclaser;  Wiley
  5. 5. VLSI Technology; Sze; McGraw-Hill

Arbeitsaufwand:

Each credit point corresponds to an approximately 25-30h of workload in average. Based on this, the amount of work for this lecture is calculated as follows:

1. Attendance to the lectures (15*2=30h)

2. Preparation to the lectures (15*2=30h)

3. Preparation to the oral exam (40h)

Total: 100h