Semiconductor Process Technologies

  • Type: Vorlesung (V)
  • Chair: KIT-Fakultäten - KIT-Fakultät für Elektrotechnik und Informationstechnik
  • Semester: SS 2022
  • Place:

    online

  • Time:

    Mi 08:00 - 09:30

  • Start: 20.04.2022
  • Lecturer:

    Dr.-Ing. Mehmet Kaynak

  • SWS: 2
  • Lv-no: 2308505
  • Information: Online

Title: Semiconductor Process Technologies

Summer semester: 2 SWS

Credit points:  3

Language: English

Success control(s): The success criteria will be determined by an oral examination (approx. 20-30 min.)

Module grade: The module grade is the grade of the oral examination.

Prerequisites: None.

Qualification Goals:

  • The students acquire a comprehensive understanding of the integrated circuit fabrication of CMOS, BiCMOS and different MEMS processes, especially for mm-wave and THz applications.
  • They have a good understanding of the different process steps (ie lithography, chemical vapor deposition, reactive ion etch, cleaning and etc.) of a CMOS process flow.
  • They can describe a complex process flow of a CMOS process together with different high frequency modules such as MEMS and photonics.
  • They can identify the pros and cons of different process flows; thus correlate it with the throughput, yield and cost aspects of the semiconductor industry.
  • They are familiar with basic packaging approaches of integrated circuits and also special advanced packaging technologies for mm-wave and THz integrated circuits as well.
  • They have the basic understanding of the scaling of CMOS industry and the future trends.

content:

In this lecture the basic fabrication technologies of integrated circuits will be given together with the each individual process steps. The front-end and back-end of line parts of the full CMOS/BiCMOS process will be provided. The testing, process monitoring and throughput/yield studies of a CMOS process will be followed after basic understanding of the semiconductor process technologies. A special emphasis on MEMS process technologies will also be given and the integration challenges of additional modules into a CMOS/BiCMOS process will be detailed. Finally, the packaging aspect of the integrated circuit industry will be given for standard and advanced packaging needs. A basic topics planned to be studied under the course are given below:

  1. Integrated Circuit Processes
  2. Cleaning and wet processes
  3. Patterning Processes: Optical and E-beam lithography
  4. Thermal processes: oxidation, diffusion, chemical vapor deposition
  5. Junction Formation: Ion implantation, spin-on, annealing
  6. In-process monitoring, measurement techniques, 
  7. Packaging: dicing, wire bonding, encapsulation
  8. testing of semiconductor devices; Process Modeling and Yields
  9. MOS process integration and MEMS processes 
  10. Scaling and future trends
  11. Non silicon processing: III-V , MBE, OMCVD

Recommendations:

The lecture materials on "Fundamentals of High Frequency Technology" and "Semiconductor Components" are recommended.

Some other suggested references are given below:

  1. 1. Introduction to Microelectronic Fabrication; Hunter; Prentice Hall
  2. 2. The Science and Engineering of Microelectronic Fabrication; Campbell; Oxford
  3. 3. Silicon Processing for the VLSI Era; Wolf and Tauber; Lattice Press
  4. 4. Microelectronics Processing and Device Design; colliers; Wiley
  5. 5. VLSI Technology; sze; McGraw-Hill

Workload:

Each credit point corresponds to an approximately 25-30h of workload on average. Based on this, the amount of work for this lecture is calculated as follows:

1. Attendance to the lectures (15*2=30h)

2. Preparation for the lectures (15*2=30h)

3. Preparation for the oral exam (40 hours)

Total: 100h

You can go to Ilias page for registration.