Institute of Radio Frequency Engineering and Electronics (IHE)

Electronic Manufacturing

  • Etching machine: Bungard Sprint 4500
    • Etching liquid: iron(III) chloride
    • 50 µm line and space with 17 µm copper clad PCB

 

  • Rapid prototyping PCB milling machine: LPKF S62
    • Via drilling
    • Board cutouts

 

  • Laser direct structuring system: LPKF ProtoLaser R4
    • Picosecond laser allows processing of heat-sensitive materials
    • Pulse width: 1.5 ps
    • Wavelength: 515 nm (green)
    • Laser output: 8 W
    • Laser diameter: 15 µm
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Etching machine Bungard Sprint 4500
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PCB milling machine LPKF S62
LPKF ProtoLaser R4
LPKF ProtoLaser R4