Packaging Lab
The following equipment are available in the laboratory for integrated circuit packaging, assembly and interconnection.
↵
|
Fully-automatic wirebonder, FS-Bondtech FS-5610i |
|
|
Semi-automatic wirebonder, TPT HB16 |
|
|
FlipChip Bonder Fineplacer Pico |
|
|
FlipChip Bonder Fineplacer Lambda |
|
|
Leica DM6 Microscope |
Photos: A. Bhutani