english  | Home | Impressum | Sitemap | KIT

Packaging Lab

Packaging lab
Packaging lab (Photo: Müller/KIT)
  • wire bonder TPT HB16
  • flip chip bonder Fineplacer L
  • rework station PDR Rework
  • microscope Leica DM6
  • reflow oven ProtoFlow S

Electronic Manufacturing

  • etching: Trans-rapid Typ 4500 CS-USL (iron(III) chloride)
  • Rapid prototyping PCB milling machine LPKF S62

Machine Shop

Machine shop
Machine shop (Photo: Müller/KIT)
  • CNC milling machine Imes Icore (4 axes)
  • CNC milling machine Hermle UWF 721 (3 axes)
  • CAD Inventor, Mastercam CAM
  • 3D printer MakerBot Replicator 2
  • lathe