Institute of Radio Frequency Engineering and Electronics (IHE)

Electronic Manufacturing

  • Etching machine: Bungard Sprint 4500
    • Etching liquid: iron(III) chloride
    • 50 µm line and space with 17 µm copper clad PCB


  • Rapid prototyping PCB milling machine: LPKF S62
    • Via drilling
    • Board cutouts


  • Laser direct structuring system: LPKF ProtoLaser R4
    • Picosecond laser allows processing of heat-sensitive materials
    • Pulse width: 1.5 ps
    • Wavelength: 515 nm (green)
    • Laser output: 8 W
    • Laser diameter: 15 µm
Etching machine Bungard Sprint 4500
PCB milling machine LPKF S62
LPKF ProtoLaser R4
LPKF ProtoLaser R4