Publications

Linear-drive amplifier-less 112 Gbit/s PAM4 operation of a silicon-organic hybrid (SOH) Mach-Zehnder modulator at 265 mV
Singer, S.; Schwarzenberger, A.; Eschenbaum, C.; Martens, M.; Mertens, A.; Dagher, G.; Valenziano, L.; Sarwar, S.; Erk, P.; Kholeif, H.; et al.
2025. Optics Express, 33 (19), Art.-Nr.: 40055. doi:10.1364/OE.551866

Ultrabroadband DC-Blocking Capacitors Using 3-D-Printed Interdigitated Finger Structures
Valenziano, L.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2025. IEEE Transactions on Microwave Theory and Techniques, 73 (9), 6010–6016. doi:10.1109/TMTT.2025.3541853

Hybrid Integration of a Beam-Steering Leaky-Wave Antenna and Power Amplifier MMIC Using UPD Printing in 220 to 325 GHz Range
Gramlich, G.; Bekker, E.; Valenziano, L.; Dittmer, J.; Roemhild, M.; Baur, H.; Thome, F.; Tessmann, A.; Kuri, M.; Neerfeld, T.; et al.
2025. IEEE Open Journal of Antennas and Propagation, 6 (3), 837–853. doi:10.1109/OJAP.2025.3551350

Multi-User Long-Distance sub-THz Wireless Communication
Dittmer, J.; Bhutani, A.; Beuthan, F.; Valenziano, L.; Wagner, S.; Tessmann, A.; Koos, C.; Zwick, T.; Randel, S.
2025. IEEE Transactions on Terahertz Science and Technology, 15 (3), 332–343. doi:10.1109/TTHZ.2025.3530757

Precision manufacturing of glass dielectric resonator antennas for sub‐THz applications using laser induced deep etching technology
Bekker, E.; Yin, J.; Valenziano, L.; Lootze, M.; Schulz-Ruhtenberg, M.; Zwick, T.; Bhutani, A.
2025. Electronics Letters, 61 (1), Art.-Nr.: e70141. doi:10.1049/ell2.70141

Advanced Bond-Wire Interconnect Solution for Ultra-Broadband Applications Covering DC to 210 GHz
Valenziano, L.; Hebeler, J.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. IEEE Transactions on Components, Packaging and Manufacturing Technology, 14 (11), 1921–1930. doi:10.1109/TCPMT.2024.3465608

Broadband packaging solution in embedded wafer level ball grid array technology for D-band PMCW radar
Bekker, E.; Gramlich, G.; Valenziano, L.; de Oliveira, L. G.; Antes, T.; Zwick, T.; Bhutani, A.
2024. International Journal of Microwave and Wireless Technologies, 16 (5), 771–782. doi:10.1017/S1759078724000266

A comprehensive packaging solution from DC to 113 GHz for InGaAs amplifiers
Valenziano, L.; Hebeler, J.; Sherifaj, A.; Thome, F.; Koos, C.; Zwick, T.; Bhutani, A.
2024. Electronics Letters, 60 (6), Art.-Nr.: e13143. doi:10.1049/ell2.13143

Sub-THz Conformal Lens Integrated WR3.4 Antenna for High-Gain Beam-Steering
Bhutani, A.; Dittmer, J.; Valenziano, L.; Zwick, T.
2024. IEEE Open Journal of Antennas and Propagation, 5 (5), 1306–1319. doi:10.1109/OJAP.2024.3412282

A 140 GHz Aperture-Coupled Stacked Patch Antenna in Multilayer PCB Technology
Valenziano, L.; Zwick, T.; Bhutani, A.
2026. 2026 17th German Microwave Conference (GeMiC), 49–52, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/GeMiC71240.2026.11516437

Fine Pitch Coplanar Waveguides on a 3D Printed Substrate Using an Optimized Laser Structuring Process
Quint, A.; Valenziano, L.; Kretschmann, M.; Maier, P.; Schwaab, P.; Gramlich, G.; Kotz, A.; Koos, C. G.; Zwick, T.; Bhutani, A.
2025. 2025 55th European Microwave Conference (EuMC 2025), Utrecht, 23rd-25th September 2025, 262–265, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11234996

Evaluation of CPW Transmission Lines on 3D Printed Alumina in D-Band
Bekker, E.; Glage, T.; Quint, A.; Valenziano, L.; Zwick, T.; Bhutani, A.
2025. 2025 55th European Microwave Conference (EuMC), Utrecht, 23rd-25th September 2025, 119–122, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11235100

Beam Steering for Long-Distance Sub-THz Links Using a Lens-Integrated Leaky-Wave Antenna
Dittmer, J.; Bhutani, A.; Valenziano, L.; Beuthan, F.; Wagner, S.; Tessmann, A.; Zwick, T.; Koos, C. G.; Randel, S.
2025. 2025 55th European Microwave Conference, EuMC 2025, Utrecht, 23rd-25th September 2025, 298–301, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11235266

A Wideband Glass Resonator Antenna as AiP Concept for Sub-THz Application
Faliero, M.; Quint, A.; Valenziano, L.; Bekker, E.; Zwick, T.; Bhutani, A.
2025. 2025 55th European Microwave Conference, EuMC 2025, Utrecht, 23rd-25th September 2025, 135–138, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11235059

Design and Optimization of a Conformal Lens for a Sub-THz Leaky-Wave Antenna
Bhutani, A.; Dittmer, J.; Gramlich, G.; Valenziano, L.; Randel, S.; Zwick, T.
2025. 2025 55th European Microwave Conference (EuMC), Utrecht, 23rd-25th September 2025, 46–49, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11235110

A 300 GHz Bond-Wire Interconnect Solution for Heterogeneous System Integration
Valenziano, L.; Hebeler, J.; Bao, Y.; Koos, C. G.; Zwick, T.; Bhutani, A.
2025. 2025 55th European Microwave Conference (EuMC 2025), Utrecht, 23rd-25th September 2025, 69–72, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC65286.2025.11235147

UPD Printed 140 GHz Split Ring Resonator Antenna for Device-to-Device Communication
Valenziano, L.; Bekker, E.; Gramlich, G.; Zwick, T.; Bhutani, A.
2025. 2025 16th German Microwave Conference (GeMiC), 92 – 95, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/GeMiC64734.2025.10979153

An Ultra-Precise Dispensing (UPD) Printed, Ultra-Broadband PCB to MMIC Interconnect
Gramlich, G.; Weiss, L.; Valenziano, L.; Roemhild, M.; Baur, H.; Schwarzenberger, A.; Eschenbaum, C.; Koos, C.; Fruehauf, N.; Zwick, T.; et al.
2025. 2025 IEEE Radio and Wireless Symposium (RWS), San Juan, 19th-22nd January 2025, 81–84, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RWS62086.2025.10904844

A 135 GHz Aperture-Coupled Antenna for D2D Communication Using Fused Silica and eWLB Technology
Valenziano, L.; Bekker, E.; Issakov, V.; Zwick, T.; Bhutani, A.
2024. 2024 54th European Microwave Conference (EuMC), 449–452, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC61614.2024.10732108

3D Printing of Interdigitated Finger Capacitors Using Ultra-Precise Deposition Technology
Valenziano, L.; Gramlich, G.; Quint, A.; Zwick, T.; Bhutani, A.
2024. 25th International Conference on Microwaves, Radar and Wireless Communications (MIKON), Wroclaw, 1st-4th July 2024, 26–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/MIKON60251.2024.10633928

Ultra-Precise Deposition – XTPL Technology for 3D Printed Broadband Spiral Inductors
Valenziano, L.; Zeh, F.; Gramlich, G.; Zwick, T.; Bhutani, A.
2024. 2024 15th German Microwave Conference (GeMiC), Duisburg, 11th-13th March 2024, 53–56, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/GeMiC59120.2024.10485325

Modified Bisection Thru-Only Deembedding Algorithm for Long Test Fixtures
Quint, A.; Valenziano, L.; Hebeler, J.; Zwick, T.; Bhutani, A.
2024. 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS), 1–6, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICMTS59902.2024.10520703

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, IEEEXplore

Spectrally Sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Photonic Multi-Chip Receiver Assembly
Fang, D.; Drayss, D.; Chen, Y.; Lauermann, M.; Peng, H.; Lihachev, G.; Quint, A.; Valenziano, L.; Randel, S.; Zwick, T.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

Linear-Drive Amplifier-Less 112 Gbit/s PAM4 Operation of a Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulator at 265 mV
Schwarzenberger, A.; Singer, S.; Eschenbaum, C.; Martens, M.; Mertens, A.; Dagher, G.; Valenziano, L.; Sarwar, S.; Kholeif, H.; Kotz, A.; et al.
2024. 2024 Optical Fiber Communications Conference and Exhibition (OFC), 1–3, Institute of Electrical and Electronics Engineers (IEEE)

Broadband, Via-less Grounded Coplanar Waveguide-to-Microstrip Transition in D-band
Bekker, E.; Gramlich, G.; Quint, A.; Valenziano, L.; Oliveira, L. G. de; Bhutani, A.; Zwick, T.
2023. 2023 53rd European Microwave Conference (EuMC), Berlin, 19th-21st September 2023, 114 – 117, Institute of Electrical and Electronics Engineers (IEEE). doi:10.23919/EuMC58039.2023.10290358

Integrated Non-sliced OAWM Engine Enabling 320 GHz Photonic-Electronic Analog-to-Digital Conversion
Drayss, D.; Fang, D.; Quint, A.; Valenziano, L.; Lauermann, M.; Lihachev, G.; Chen, Y.; Peng, H.; Randel, S.; Zwick, T.; et al.
2024, March 27. Optical Fiber Communications Conference and Exhibition (OFC 2024), San Diego, CA, USA, March 24–28, 2024

Spectrally Sliced Optical Arbitrary Waveform Measurement (OAWM) Using a Photonic Multi-Chip Receiver Assembly
Fang, D.; Drayss, D.; Chen, Y.; Lauermann, M.; Peng, H.; Lihachev, G.; Quinte, A.; Valenziano, L.; Randel, S.; Zwick, T.; et al.
2024, March 26. Optical Fiber Communications Conference and Exhibition (OFC 2024), San Diego, CA, USA, March 24–28, 2024